Printed Circuit Boards & Pcb Assembly & SMT Advanced Technology
Bingo provides customers with 20 years of experience in advanced electronic PCB Assembly technology, with proven processes and a full range of services. ,Bingo provides complete manufacturing solutions to solve all your needs. Our factories are equipped with state-of-the art equipement from leading edge vendors and staffed with professional engineering teams to deliver your prototype, new product introduction, complete assembly, low volume, and high volume requirements. In addition, we have built strong process control methodology, systems integration, flexible production techniques and proven innovative manufacturing technologies to optimize processes and drive continuous improvement
Bingo Capabilities:
- Materials Management – Complete Supply Chain Supervision
- Single-Sided, Double-Sided, Multilayer Boards
- PCBA (Printed Circuit Board Assembly)
- Standard or Multi-level Stencil
- SMT (Surface Mount Technology)
- 01005
- BGA (Ball Grid Array)
- Micro BGA
- CCGA (Ceramic Column Grid Array)
- CSP (Chip Scale Package)
- QFP (Quad Flat Package)
- QFN (Quad Flat No-leads)
- Convection Reflow
- PTH (Pin Through Hole)
- Automated Pin Through Hole Assembly
- Hand Soldering
- Wave Soldering
- No-clean Process
Bingo Advantages:
- We provide complete manufacturing strategies and life cycle solutions from the pre-manufacturing engineering stage, production, post manufacturing, logistics, fulfillment to client support to make certain manufacturing success
- Designs for Manufacturability (DFM) and Testability (DFT) to increase efficiency and reduce cost
Parts Package: DIP, CHIP, SOP, QFP, BGA, QFN, etc.
Min Parts: 0201
Min BGA Pitch: 0.5mm
Min IC Pitch: 0.4mm
X-ray and ICT test
